Global Memory Chip Packaging Substrate Supply, Demand and Key Producers, 2024-2030

Description

IC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next", and is a necessary core material in IC packaging technology. With the development of semiconductor technology, the characteristic size of IC continues to shrink, and the integration continues to improve. The corresponding IC package towards super multi-pin, narrow pitch, ultra-miniaturization direction in high-level packaging, IC substrate has replaced the traditional lead frame, becoming an indispensable part of the IC package. Memory chip packaging substrate is mainly used for smartphone and tablet computer storage modules and solid state disks.

The global Memory Chip Packaging Substrate market size is expected to reach $ million by 2030, rising at a market growth of %CAGR during the forecast period (2024-2030).

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report studies the global Memory Chip Packaging Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Memory Chip Packaging Substrate and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Memory Chip Packaging Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Memory Chip Packaging Substrate total production and demand, 2019-2030, (K Sqm)
Global Memory Chip Packaging Substrate total production value, 2019-2030, (USD Million)
Global Memory Chip Packaging Substrate production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm), (based on production site)
Global Memory Chip Packaging Substrate consumption by region & country, CAGR, 2019-2030 & (K Sqm)
U.S. VS China: Memory Chip Packaging Substrate domestic production, consumption, key domestic manufacturers and share
Global Memory Chip Packaging Substrate production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (K Sqm)
Global Memory Chip Packaging Substrate production by Type, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
Global Memory Chip Packaging Substrate production by Application, production, value, CAGR, 2019-2030, (USD Million) & (K Sqm)
This report profiles key players in the global Memory Chip Packaging Substrate market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung Electro-Mechanics, Simmtech, Daeduck, Korea Circuit, Ibiden, Kyocera, ASE Group, Shinko, Fujitsu Global, Doosan Electronic, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Memory Chip Packaging Substrate market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Sqm) and average price (US$/Sqm) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Memory Chip Packaging Substrate Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Memory Chip Packaging Substrate Market, Segmentation by Type:
    WB BGA
    WB-CSP
    Others

Global Memory Chip Packaging Substrate Market, Segmentation by Application:
    Flash Drive
    Solid State Storage
    Embedded Storage
    Volatile Storage
    Others

Companies Profiled:
    Samsung Electro-Mechanics
    Simmtech
    Daeduck
    Korea Circuit
    Ibiden
    Kyocera
    ASE Group
    Shinko
    Fujitsu Global
    Doosan Electronic
    Toppan Printing
    Unimicron
    Kinsus
    Nanya
    Fastprint Circuit
    Shennan Circuits

Key Questions Answered:
1. How big is the global Memory Chip Packaging Substrate market?
2. What is the demand of the global Memory Chip Packaging Substrate market?
3. What is the year over year growth of the global Memory Chip Packaging Substrate market?
4. What is the production and production value of the global Memory Chip Packaging Substrate market?
5. Who are the key producers in the global Memory Chip Packaging Substrate market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 Memory Chip Packaging Substrate Introduction
    1.2 World Memory Chip Packaging Substrate Supply & Forecast
        1.2.1 World Memory Chip Packaging Substrate Production Value (2019 & 2023 & 2030)
        1.2.2 World Memory Chip Packaging Substrate Production (2019-2030)
        1.2.3 World Memory Chip Packaging Substrate Pricing Trends (2019-2030)
    1.3 World Memory Chip Packaging Substrate Production by Region (Based on Production Site)
        1.3.1 World Memory Chip Packaging Substrate Production Value by Region (2019-2030)
        1.3.2 World Memory Chip Packaging Substrate Production by Region (2019-2030)
        1.3.3 World Memory Chip Packaging Substrate Average Price by Region (2019-2030)
        1.3.4 North America Memory Chip Packaging Substrate Production (2019-2030)
        1.3.5 Europe Memory Chip Packaging Substrate Production (2019-2030)
        1.3.6 China Memory Chip Packaging Substrate Production (2019-2030)
        1.3.7 Japan Memory Chip Packaging Substrate Production (2019-2030)
        1.3.8 South Korea Memory Chip Packaging Substrate Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Memory Chip Packaging Substrate Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Memory Chip Packaging Substrate Major Market Trends

2 Demand Summary
    2.1 World Memory Chip Packaging Substrate Demand (2019-2030)
    2.2 World Memory Chip Packaging Substrate Consumption by Region
        2.2.1 World Memory Chip Packaging Substrate Consumption by Region (2019-2024)
        2.2.2 World Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030)
    2.3 United States Memory Chip Packaging Substrate Consumption (2019-2030)
    2.4 China Memory Chip Packaging Substrate Consumption (2019-2030)
    2.5 Europe Memory Chip Packaging Substrate Consumption (2019-2030)
    2.6 Japan Memory Chip Packaging Substrate Consumption (2019-2030)
    2.7 South Korea Memory Chip Packaging Substrate Consumption (2019-2030)
    2.8 ASEAN Memory Chip Packaging Substrate Consumption (2019-2030)
    2.9 India Memory Chip Packaging Substrate Consumption (2019-2030)

3 World Manufacturers Competitive Analysis
    3.1 World Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024)
    3.2 World Memory Chip Packaging Substrate Production by Manufacturer (2019-2024)
    3.3 World Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024)
    3.4 Memory Chip Packaging Substrate Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Memory Chip Packaging Substrate Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Memory Chip Packaging Substrate in 2023
        3.5.3 Global Concentration Ratios (CR8) for Memory Chip Packaging Substrate in 2023
    3.6 Memory Chip Packaging Substrate Market: Overall Company Footprint Analysis
        3.6.1 Memory Chip Packaging Substrate Market: Region Footprint
        3.6.2 Memory Chip Packaging Substrate Market: Company Product Type Footprint
        3.6.3 Memory Chip Packaging Substrate Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Memory Chip Packaging Substrate Production Value Comparison
        4.1.1 United States VS China: Memory Chip Packaging Substrate Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Memory Chip Packaging Substrate Production Comparison
        4.2.1 United States VS China: Memory Chip Packaging Substrate Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Memory Chip Packaging Substrate Consumption Comparison
        4.3.1 United States VS China: Memory Chip Packaging Substrate Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Memory Chip Packaging Substrate Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Memory Chip Packaging Substrate Production (2019-2024)
    4.5 China Based Memory Chip Packaging Substrate Manufacturers and Market Share
        4.5.1 China Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Memory Chip Packaging Substrate Production Value (2019-2024)
        4.5.3 China Based Manufacturers Memory Chip Packaging Substrate Production (2019-2024)
    4.6 Rest of World Based Memory Chip Packaging Substrate Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Memory Chip Packaging Substrate Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Memory Chip Packaging Substrate Production (2019-2024)

5 Market Analysis by Type
    5.1 World Memory Chip Packaging Substrate Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 WB BGA
        5.2.2 WB-CSP
        5.2.3 Others
    5.3 Market Segment by Type
        5.3.1 World Memory Chip Packaging Substrate Production by Type (2019-2030)
        5.3.2 World Memory Chip Packaging Substrate Production Value by Type (2019-2030)
        5.3.3 World Memory Chip Packaging Substrate Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Memory Chip Packaging Substrate Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Flash Drive
        6.2.2 Solid State Storage
        6.2.3 Embedded Storage
        6.2.4 Volatile Storage
        6.2.5 Others
    6.3 Market Segment by Application
        6.3.1 World Memory Chip Packaging Substrate Production by Application (2019-2030)
        6.3.2 World Memory Chip Packaging Substrate Production Value by Application (2019-2030)
        6.3.3 World Memory Chip Packaging Substrate Average Price by Application (2019-2030)

7 Company Profiles
    7.1 Samsung Electro-Mechanics
        7.1.1 Samsung Electro-Mechanics Details
        7.1.2 Samsung Electro-Mechanics Major Business
        7.1.3 Samsung Electro-Mechanics Memory Chip Packaging Substrate Product and Services
        7.1.4 Samsung Electro-Mechanics Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
        7.1.6 Samsung Electro-Mechanics Competitive Strengths & Weaknesses
    7.2 Simmtech
        7.2.1 Simmtech Details
        7.2.2 Simmtech Major Business
        7.2.3 Simmtech Memory Chip Packaging Substrate Product and Services
        7.2.4 Simmtech Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Simmtech Recent Developments/Updates
        7.2.6 Simmtech Competitive Strengths & Weaknesses
    7.3 Daeduck
        7.3.1 Daeduck Details
        7.3.2 Daeduck Major Business
        7.3.3 Daeduck Memory Chip Packaging Substrate Product and Services
        7.3.4 Daeduck Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 Daeduck Recent Developments/Updates
        7.3.6 Daeduck Competitive Strengths & Weaknesses
    7.4 Korea Circuit
        7.4.1 Korea Circuit Details
        7.4.2 Korea Circuit Major Business
        7.4.3 Korea Circuit Memory Chip Packaging Substrate Product and Services
        7.4.4 Korea Circuit Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 Korea Circuit Recent Developments/Updates
        7.4.6 Korea Circuit Competitive Strengths & Weaknesses
    7.5 Ibiden
        7.5.1 Ibiden Details
        7.5.2 Ibiden Major Business
        7.5.3 Ibiden Memory Chip Packaging Substrate Product and Services
        7.5.4 Ibiden Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Ibiden Recent Developments/Updates
        7.5.6 Ibiden Competitive Strengths & Weaknesses
    7.6 Kyocera
        7.6.1 Kyocera Details
        7.6.2 Kyocera Major Business
        7.6.3 Kyocera Memory Chip Packaging Substrate Product and Services
        7.6.4 Kyocera Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 Kyocera Recent Developments/Updates
        7.6.6 Kyocera Competitive Strengths & Weaknesses
    7.7 ASE Group
        7.7.1 ASE Group Details
        7.7.2 ASE Group Major Business
        7.7.3 ASE Group Memory Chip Packaging Substrate Product and Services
        7.7.4 ASE Group Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 ASE Group Recent Developments/Updates
        7.7.6 ASE Group Competitive Strengths & Weaknesses
    7.8 Shinko
        7.8.1 Shinko Details
        7.8.2 Shinko Major Business
        7.8.3 Shinko Memory Chip Packaging Substrate Product and Services
        7.8.4 Shinko Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 Shinko Recent Developments/Updates
        7.8.6 Shinko Competitive Strengths & Weaknesses
    7.9 Fujitsu Global
        7.9.1 Fujitsu Global Details
        7.9.2 Fujitsu Global Major Business
        7.9.3 Fujitsu Global Memory Chip Packaging Substrate Product and Services
        7.9.4 Fujitsu Global Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 Fujitsu Global Recent Developments/Updates
        7.9.6 Fujitsu Global Competitive Strengths & Weaknesses
    7.10 Doosan Electronic
        7.10.1 Doosan Electronic Details
        7.10.2 Doosan Electronic Major Business
        7.10.3 Doosan Electronic Memory Chip Packaging Substrate Product and Services
        7.10.4 Doosan Electronic Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Doosan Electronic Recent Developments/Updates
        7.10.6 Doosan Electronic Competitive Strengths & Weaknesses
    7.11 Toppan Printing
        7.11.1 Toppan Printing Details
        7.11.2 Toppan Printing Major Business
        7.11.3 Toppan Printing Memory Chip Packaging Substrate Product and Services
        7.11.4 Toppan Printing Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 Toppan Printing Recent Developments/Updates
        7.11.6 Toppan Printing Competitive Strengths & Weaknesses
    7.12 Unimicron
        7.12.1 Unimicron Details
        7.12.2 Unimicron Major Business
        7.12.3 Unimicron Memory Chip Packaging Substrate Product and Services
        7.12.4 Unimicron Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Unimicron Recent Developments/Updates
        7.12.6 Unimicron Competitive Strengths & Weaknesses
    7.13 Kinsus
        7.13.1 Kinsus Details
        7.13.2 Kinsus Major Business
        7.13.3 Kinsus Memory Chip Packaging Substrate Product and Services
        7.13.4 Kinsus Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.13.5 Kinsus Recent Developments/Updates
        7.13.6 Kinsus Competitive Strengths & Weaknesses
    7.14 Nanya
        7.14.1 Nanya Details
        7.14.2 Nanya Major Business
        7.14.3 Nanya Memory Chip Packaging Substrate Product and Services
        7.14.4 Nanya Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.14.5 Nanya Recent Developments/Updates
        7.14.6 Nanya Competitive Strengths & Weaknesses
    7.15 Fastprint Circuit
        7.15.1 Fastprint Circuit Details
        7.15.2 Fastprint Circuit Major Business
        7.15.3 Fastprint Circuit Memory Chip Packaging Substrate Product and Services
        7.15.4 Fastprint Circuit Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.15.5 Fastprint Circuit Recent Developments/Updates
        7.15.6 Fastprint Circuit Competitive Strengths & Weaknesses
    7.16 Shennan Circuits
        7.16.1 Shennan Circuits Details
        7.16.2 Shennan Circuits Major Business
        7.16.3 Shennan Circuits Memory Chip Packaging Substrate Product and Services
        7.16.4 Shennan Circuits Memory Chip Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.16.5 Shennan Circuits Recent Developments/Updates
        7.16.6 Shennan Circuits Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Memory Chip Packaging Substrate Industry Chain
    8.2 Memory Chip Packaging Substrate Upstream Analysis
        8.2.1 Memory Chip Packaging Substrate Core Raw Materials
        8.2.2 Main Manufacturers of Memory Chip Packaging Substrate Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Memory Chip Packaging Substrate Production Mode
    8.6 Memory Chip Packaging Substrate Procurement Model
    8.7 Memory Chip Packaging Substrate Industry Sales Model and Sales Channels
        8.7.1 Memory Chip Packaging Substrate Sales Model
        8.7.2 Memory Chip Packaging Substrate Typical Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. World Memory Chip Packaging Substrate Production Value by Region (2019, 2023 and 2030) & (USD Million)
 Table 2. World Memory Chip Packaging Substrate Production Value by Region (2019-2024) & (USD Million)
 Table 3. World Memory Chip Packaging Substrate Production Value by Region (2025-2030) & (USD Million)
 Table 4. World Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
 Table 5. World Memory Chip Packaging Substrate Production Value Market Share by Region (2025-2030)
 Table 6. World Memory Chip Packaging Substrate Production by Region (2019-2024) & (K Sqm)
 Table 7. World Memory Chip Packaging Substrate Production by Region (2025-2030) & (K Sqm)
 Table 8. World Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
 Table 9. World Memory Chip Packaging Substrate Production Market Share by Region (2025-2030)
 Table 10. World Memory Chip Packaging Substrate Average Price by Region (2019-2024) & (US$/Sqm)
 Table 11. World Memory Chip Packaging Substrate Average Price by Region (2025-2030) & (US$/Sqm)
 Table 12. Memory Chip Packaging Substrate Major Market Trends
 Table 13. World Memory Chip Packaging Substrate Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (K Sqm)
 Table 14. World Memory Chip Packaging Substrate Consumption by Region (2019-2024) & (K Sqm)
 Table 15. World Memory Chip Packaging Substrate Consumption Forecast by Region (2025-2030) & (K Sqm)
 Table 16. World Memory Chip Packaging Substrate Production Value by Manufacturer (2019-2024) & (USD Million)
 Table 17. Production Value Market Share of Key Memory Chip Packaging Substrate Producers in 2023
 Table 18. World Memory Chip Packaging Substrate Production by Manufacturer (2019-2024) & (K Sqm)
 Table 19. Production Market Share of Key Memory Chip Packaging Substrate Producers in 2023
 Table 20. World Memory Chip Packaging Substrate Average Price by Manufacturer (2019-2024) & (US$/Sqm)
 Table 21. Global Memory Chip Packaging Substrate Company Evaluation Quadrant
 Table 22. World Memory Chip Packaging Substrate Industry Rank of Major Manufacturers, Based on Production Value in 2023
 Table 23. Head Office and Memory Chip Packaging Substrate Production Site of Key Manufacturer
 Table 24. Memory Chip Packaging Substrate Market: Company Product Type Footprint
 Table 25. Memory Chip Packaging Substrate Market: Company Product Application Footprint
 Table 26. Memory Chip Packaging Substrate Competitive Factors
 Table 27. Memory Chip Packaging Substrate New Entrant and Capacity Expansion Plans
 Table 28. Memory Chip Packaging Substrate Mergers & Acquisitions Activity
 Table 29. United States VS China Memory Chip Packaging Substrate Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
 Table 30. United States VS China Memory Chip Packaging Substrate Production Comparison, (2019 & 2023 & 2030) & (K Sqm)
 Table 31. United States VS China Memory Chip Packaging Substrate Consumption Comparison, (2019 & 2023 & 2030) & (K Sqm)
 Table 32. United States Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
 Table 33. United States Based Manufacturers Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 34. United States Based Manufacturers Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 35. United States Based Manufacturers Memory Chip Packaging Substrate Production (2019-2024) & (K Sqm)
 Table 36. United States Based Manufacturers Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 37. China Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
 Table 38. China Based Manufacturers Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 39. China Based Manufacturers Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 40. China Based Manufacturers Memory Chip Packaging Substrate Production, (2019-2024) & (K Sqm)
 Table 41. China Based Manufacturers Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 42. Rest of World Based Memory Chip Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
 Table 43. Rest of World Based Manufacturers Memory Chip Packaging Substrate Production Value, (2019-2024) & (USD Million)
 Table 44. Rest of World Based Manufacturers Memory Chip Packaging Substrate Production Value Market Share (2019-2024)
 Table 45. Rest of World Based Manufacturers Memory Chip Packaging Substrate Production, (2019-2024) & (K Sqm)
 Table 46. Rest of World Based Manufacturers Memory Chip Packaging Substrate Production Market Share (2019-2024)
 Table 47. World Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Table 48. World Memory Chip Packaging Substrate Production by Type (2019-2024) & (K Sqm)
 Table 49. World Memory Chip Packaging Substrate Production by Type (2025-2030) & (K Sqm)
 Table 50. World Memory Chip Packaging Substrate Production Value by Type (2019-2024) & (USD Million)
 Table 51. World Memory Chip Packaging Substrate Production Value by Type (2025-2030) & (USD Million)
 Table 52. World Memory Chip Packaging Substrate Average Price by Type (2019-2024) & (US$/Sqm)
 Table 53. World Memory Chip Packaging Substrate Average Price by Type (2025-2030) & (US$/Sqm)
 Table 54. World Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Table 55. World Memory Chip Packaging Substrate Production by Application (2019-2024) & (K Sqm)
 Table 56. World Memory Chip Packaging Substrate Production by Application (2025-2030) & (K Sqm)
 Table 57. World Memory Chip Packaging Substrate Production Value by Application (2019-2024) & (USD Million)
 Table 58. World Memory Chip Packaging Substrate Production Value by Application (2025-2030) & (USD Million)
 Table 59. World Memory Chip Packaging Substrate Average Price by Application (2019-2024) & (US$/Sqm)
 Table 60. World Memory Chip Packaging Substrate Average Price by Application (2025-2030) & (US$/Sqm)
 Table 61. Samsung Electro-Mechanics Basic Information, Manufacturing Base and Competitors
 Table 62. Samsung Electro-Mechanics Major Business
 Table 63. Samsung Electro-Mechanics Memory Chip Packaging Substrate Product and Services
 Table 64. Samsung Electro-Mechanics Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 65. Samsung Electro-Mechanics Recent Developments/Updates
 Table 66. Samsung Electro-Mechanics Competitive Strengths & Weaknesses
 Table 67. Simmtech Basic Information, Manufacturing Base and Competitors
 Table 68. Simmtech Major Business
 Table 69. Simmtech Memory Chip Packaging Substrate Product and Services
 Table 70. Simmtech Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 71. Simmtech Recent Developments/Updates
 Table 72. Simmtech Competitive Strengths & Weaknesses
 Table 73. Daeduck Basic Information, Manufacturing Base and Competitors
 Table 74. Daeduck Major Business
 Table 75. Daeduck Memory Chip Packaging Substrate Product and Services
 Table 76. Daeduck Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 77. Daeduck Recent Developments/Updates
 Table 78. Daeduck Competitive Strengths & Weaknesses
 Table 79. Korea Circuit Basic Information, Manufacturing Base and Competitors
 Table 80. Korea Circuit Major Business
 Table 81. Korea Circuit Memory Chip Packaging Substrate Product and Services
 Table 82. Korea Circuit Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 83. Korea Circuit Recent Developments/Updates
 Table 84. Korea Circuit Competitive Strengths & Weaknesses
 Table 85. Ibiden Basic Information, Manufacturing Base and Competitors
 Table 86. Ibiden Major Business
 Table 87. Ibiden Memory Chip Packaging Substrate Product and Services
 Table 88. Ibiden Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 89. Ibiden Recent Developments/Updates
 Table 90. Ibiden Competitive Strengths & Weaknesses
 Table 91. Kyocera Basic Information, Manufacturing Base and Competitors
 Table 92. Kyocera Major Business
 Table 93. Kyocera Memory Chip Packaging Substrate Product and Services
 Table 94. Kyocera Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 95. Kyocera Recent Developments/Updates
 Table 96. Kyocera Competitive Strengths & Weaknesses
 Table 97. ASE Group Basic Information, Manufacturing Base and Competitors
 Table 98. ASE Group Major Business
 Table 99. ASE Group Memory Chip Packaging Substrate Product and Services
 Table 100. ASE Group Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 101. ASE Group Recent Developments/Updates
 Table 102. ASE Group Competitive Strengths & Weaknesses
 Table 103. Shinko Basic Information, Manufacturing Base and Competitors
 Table 104. Shinko Major Business
 Table 105. Shinko Memory Chip Packaging Substrate Product and Services
 Table 106. Shinko Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 107. Shinko Recent Developments/Updates
 Table 108. Shinko Competitive Strengths & Weaknesses
 Table 109. Fujitsu Global Basic Information, Manufacturing Base and Competitors
 Table 110. Fujitsu Global Major Business
 Table 111. Fujitsu Global Memory Chip Packaging Substrate Product and Services
 Table 112. Fujitsu Global Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 113. Fujitsu Global Recent Developments/Updates
 Table 114. Fujitsu Global Competitive Strengths & Weaknesses
 Table 115. Doosan Electronic Basic Information, Manufacturing Base and Competitors
 Table 116. Doosan Electronic Major Business
 Table 117. Doosan Electronic Memory Chip Packaging Substrate Product and Services
 Table 118. Doosan Electronic Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 119. Doosan Electronic Recent Developments/Updates
 Table 120. Doosan Electronic Competitive Strengths & Weaknesses
 Table 121. Toppan Printing Basic Information, Manufacturing Base and Competitors
 Table 122. Toppan Printing Major Business
 Table 123. Toppan Printing Memory Chip Packaging Substrate Product and Services
 Table 124. Toppan Printing Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 125. Toppan Printing Recent Developments/Updates
 Table 126. Toppan Printing Competitive Strengths & Weaknesses
 Table 127. Unimicron Basic Information, Manufacturing Base and Competitors
 Table 128. Unimicron Major Business
 Table 129. Unimicron Memory Chip Packaging Substrate Product and Services
 Table 130. Unimicron Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 131. Unimicron Recent Developments/Updates
 Table 132. Unimicron Competitive Strengths & Weaknesses
 Table 133. Kinsus Basic Information, Manufacturing Base and Competitors
 Table 134. Kinsus Major Business
 Table 135. Kinsus Memory Chip Packaging Substrate Product and Services
 Table 136. Kinsus Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 137. Kinsus Recent Developments/Updates
 Table 138. Kinsus Competitive Strengths & Weaknesses
 Table 139. Nanya Basic Information, Manufacturing Base and Competitors
 Table 140. Nanya Major Business
 Table 141. Nanya Memory Chip Packaging Substrate Product and Services
 Table 142. Nanya Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 143. Nanya Recent Developments/Updates
 Table 144. Nanya Competitive Strengths & Weaknesses
 Table 145. Fastprint Circuit Basic Information, Manufacturing Base and Competitors
 Table 146. Fastprint Circuit Major Business
 Table 147. Fastprint Circuit Memory Chip Packaging Substrate Product and Services
 Table 148. Fastprint Circuit Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 149. Fastprint Circuit Recent Developments/Updates
 Table 150. Fastprint Circuit Competitive Strengths & Weaknesses
 Table 151. Shennan Circuits Basic Information, Manufacturing Base and Competitors
 Table 152. Shennan Circuits Major Business
 Table 153. Shennan Circuits Memory Chip Packaging Substrate Product and Services
 Table 154. Shennan Circuits Memory Chip Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
 Table 155. Shennan Circuits Recent Developments/Updates
 Table 156. Shennan Circuits Competitive Strengths & Weaknesses
 Table 157. Global Key Players of Memory Chip Packaging Substrate Upstream (Raw Materials)
 Table 158. Global Memory Chip Packaging Substrate Typical Customers
 Table 159. Memory Chip Packaging Substrate Typical Distributors


List of Figures
 Figure 1. Memory Chip Packaging Substrate Picture
 Figure 2. World Memory Chip Packaging Substrate Production Value: 2019 & 2023 & 2030, (USD Million)
 Figure 3. World Memory Chip Packaging Substrate Production Value and Forecast (2019-2030) & (USD Million)
 Figure 4. World Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 5. World Memory Chip Packaging Substrate Average Price (2019-2030) & (US$/Sqm)
 Figure 6. World Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2030)
 Figure 7. World Memory Chip Packaging Substrate Production Market Share by Region (2019-2030)
 Figure 8. North America Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 9. Europe Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 10. China Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 11. Japan Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 12. South Korea Memory Chip Packaging Substrate Production (2019-2030) & (K Sqm)
 Figure 13. Memory Chip Packaging Substrate Market Drivers
 Figure 14. Factors Affecting Demand
 Figure 15. World Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 16. World Memory Chip Packaging Substrate Consumption Market Share by Region (2019-2030)
 Figure 17. United States Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 18. China Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 19. Europe Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 20. Japan Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 21. South Korea Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 22. ASEAN Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 23. India Memory Chip Packaging Substrate Consumption (2019-2030) & (K Sqm)
 Figure 24. Producer Shipments of Memory Chip Packaging Substrate by Manufacturer Revenue ($MM) and Market Share (%): 2023
 Figure 25. Global Four-firm Concentration Ratios (CR4) for Memory Chip Packaging Substrate Markets in 2023
 Figure 26. Global Four-firm Concentration Ratios (CR8) for Memory Chip Packaging Substrate Markets in 2023
 Figure 27. United States VS China: Memory Chip Packaging Substrate Production Value Market Share Comparison (2019 & 2023 & 2030)
 Figure 28. United States VS China: Memory Chip Packaging Substrate Production Market Share Comparison (2019 & 2023 & 2030)
 Figure 29. United States VS China: Memory Chip Packaging Substrate Consumption Market Share Comparison (2019 & 2023 & 2030)
 Figure 30. United States Based Manufacturers Memory Chip Packaging Substrate Production Market Share 2023
 Figure 31. China Based Manufacturers Memory Chip Packaging Substrate Production Market Share 2023
 Figure 32. Rest of World Based Manufacturers Memory Chip Packaging Substrate Production Market Share 2023
 Figure 33. World Memory Chip Packaging Substrate Production Value by Type, (USD Million), 2019 & 2023 & 2030
 Figure 34. World Memory Chip Packaging Substrate Production Value Market Share by Type in 2023
 Figure 35. WB BGA
 Figure 36. WB-CSP
 Figure 37. Others
 Figure 38. World Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
 Figure 39. World Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
 Figure 40. World Memory Chip Packaging Substrate Average Price by Type (2019-2030) & (US$/Sqm)
 Figure 41. World Memory Chip Packaging Substrate Production Value by Application, (USD Million), 2019 & 2023 & 2030
 Figure 42. World Memory Chip Packaging Substrate Production Value Market Share by Application in 2023
 Figure 43. Flash Drive
 Figure 44. Solid State Storage
 Figure 45. Embedded Storage
 Figure 46. Volatile Storage
 Figure 47. Others
 Figure 48. World Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
 Figure 49. World Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
 Figure 50. World Memory Chip Packaging Substrate Average Price by Application (2019-2030) & (US$/Sqm)
 Figure 51. Memory Chip Packaging Substrate Industry Chain
 Figure 52. Memory Chip Packaging Substrate Procurement Model
 Figure 53. Memory Chip Packaging Substrate Sales Model
 Figure 54. Memory Chip Packaging Substrate Sales Channels, Direct Sales, and Distribution
 Figure 55. Methodology
 Figure 56. Research Process and Data Source

Companies Mentioned

Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
Fastprint Circuit
Shennan Circuits