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IC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next", and is a necessary core material in IC packaging technology. With the development of semiconductor technology, the characteristic size of IC continues to shrink, and the integration continues to improve. The corresponding IC package towards super multi-pin, narrow pitch, ultra-miniaturization direction in high-level packaging, IC substrate has replaced the traditional lead frame, becoming an indispensable part of the IC package. Memory chip packaging substrate is mainly used for smartphone and tablet computer storage modules and solid state disks.

USD4480.00

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IC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next", and is a necessary core material in IC packaging technology. With the development of semiconductor technology, the characteristic size of IC continues to shrink, and the integration continues to improve. The corresponding IC package towards super multi-pin, narrow pitch, ultra-miniaturization direction in high-level packaging, IC substrate has replaced the traditional lead frame, becoming an indispensable part of the IC package. Memory chip packaging substrate is mainly used for smartphone and tablet computer storage modules and solid state disks.

USD3480.00

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Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.

USD3480.00

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Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.

USD4480.00

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Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.

USD3480.00

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Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.

USD4480.00

Add To Cart