Global Chip Packaging Supply, Demand and Key Producers, 2024-2030

Description

The global Chip Packaging market size is expected to reach $ 48900 million by 2030, rising at a market growth of 6.2% CAGR during the forecast period (2024-2030).

By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.

The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.

From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.

The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

This report studies the global Chip Packaging demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for Chip Packaging, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Chip Packaging total market, 2019-2030, (USD Million)
Global Chip Packaging total market by region & country, CAGR, 2019-2030, (USD Million)
U.S. VS China: Chip Packaging total market, key domestic companies and share, (USD Million)
Global Chip Packaging revenue by player and market share 2019-2024, (USD Million)
Global Chip Packaging total market by Type, CAGR, 2019-2030, (USD Million)
Global Chip Packaging total market by Application, CAGR, 2019-2030, (USD Million).

This reports profiles major players in the global Chip Packaging market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip Packaging market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Chip Packaging Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Chip Packaging Market, Segmentation by Type
    Traditional Packaging
    Advanced Packaging

Global Chip Packaging Market, Segmentation by Application
    Automotive and Traffic
    Consumer Electronics
    Communication
    Other

Companies Profiled:
    ASE Group
    Amkor Technology
    JCET
    Siliconware Precision Industries
    Powertech Technology
    TongFu Microelectronics
    Tianshui Huatian Technology
    UTAC
    Chipbond Technology
    Hana Micron
    OSE
    Walton Advanced Engineering
    NEPES
    Unisem
    ChipMOS
    Signetics
    Carsem
    King Yuan ELECTRONICS

Key Questions Answered
1. How big is the global Chip Packaging market?
2. What is the demand of the global Chip Packaging market?
3. What is the year over year growth of the global Chip Packaging market?
4. What is the total value of the global Chip Packaging market?
5. Who are the major players in the global Chip Packaging market?

Table of Contents

1 Supply Summary
    1.1 Chip Packaging Introduction
    1.2 World Chip Packaging Market Size & Forecast (2019 & 2023 & 2030)
    1.3 World Chip Packaging Total Market by Region (by Headquarter Location)
        1.3.1 World Chip Packaging Market Size by Region (2019-2030), (by Headquarter Location)
        1.3.2 United States Chip Packaging Market Size (2019-2030)
        1.3.3 China Chip Packaging Market Size (2019-2030)
        1.3.4 Europe Chip Packaging Market Size (2019-2030)
        1.3.5 Japan Chip Packaging Market Size (2019-2030)
        1.3.6 South Korea Chip Packaging Market Size (2019-2030)
        1.3.7 ASEAN Chip Packaging Market Size (2019-2030)
        1.3.8 India Chip Packaging Market Size (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Chip Packaging Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Chip Packaging Major Market Trends

2 Demand Summary
    2.1 World Chip Packaging Consumption Value (2019-2030)
    2.2 World Chip Packaging Consumption Value by Region
        2.2.1 World Chip Packaging Consumption Value by Region (2019-2024)
        2.2.2 World Chip Packaging Consumption Value Forecast by Region (2025-2030)
    2.3 United States Chip Packaging Consumption Value (2019-2030)
    2.4 China Chip Packaging Consumption Value (2019-2030)
    2.5 Europe Chip Packaging Consumption Value (2019-2030)
    2.6 Japan Chip Packaging Consumption Value (2019-2030)
    2.7 South Korea Chip Packaging Consumption Value (2019-2030)
    2.8 ASEAN Chip Packaging Consumption Value (2019-2030)
    2.9 India Chip Packaging Consumption Value (2019-2030)

3 World Chip Packaging Companies Competitive Analysis
    3.1 World Chip Packaging Revenue by Player (2019-2024)
    3.2 Industry Rank and Concentration Rate (CR)
        3.2.1 Global Chip Packaging Industry Rank of Major Players
        3.2.2 Global Concentration Ratios (CR4) for Chip Packaging in 2023
        3.2.3 Global Concentration Ratios (CR8) for Chip Packaging in 2023
    3.3 Chip Packaging Company Evaluation Quadrant
    3.4 Chip Packaging Market: Overall Company Footprint Analysis
        3.4.1 Chip Packaging Market: Region Footprint
        3.4.2 Chip Packaging Market: Company Product Type Footprint
        3.4.3 Chip Packaging Market: Company Product Application Footprint
    3.5 Competitive Environment
        3.5.1 Historical Structure of the Industry
        3.5.2 Barriers of Market Entry
        3.5.3 Factors of Competition
    3.6 Mergers, Acquisitions Activity

4 United States VS China VS Rest of the World (by Headquarter Location)
    4.1 United States VS China: Chip Packaging Revenue Comparison (by Headquarter Location)
        4.1.1 United States VS China: Chip Packaging Market Size Comparison (2019 & 2023 & 2030) (by Headquarter Location)
        4.1.2 United States VS China: Chip Packaging Revenue Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States Based Companies VS China Based Companies: Chip Packaging Consumption Value Comparison
        4.2.1 United States VS China: Chip Packaging Consumption Value Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Chip Packaging Consumption Value Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States Based Chip Packaging Companies and Market Share, 2019-2024
        4.3.1 United States Based Chip Packaging Companies, Headquarters (States, Country)
        4.3.2 United States Based Companies Chip Packaging Revenue, (2019-2024)
    4.4 China Based Companies Chip Packaging Revenue and Market Share, 2019-2024
        4.4.1 China Based Chip Packaging Companies, Company Headquarters (Province, Country)
        4.4.2 China Based Companies Chip Packaging Revenue, (2019-2024)
    4.5 Rest of World Based Chip Packaging Companies and Market Share, 2019-2024
        4.5.1 Rest of World Based Chip Packaging Companies, Headquarters (States, Country)
        4.5.2 Rest of World Based Companies Chip Packaging Revenue, (2019-2024)

5 Market Analysis by Type
    5.1 World Chip Packaging Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Traditional Packaging
        5.2.2 Advanced Packaging
    5.3 Market Segment by Type
        5.3.1 World Chip Packaging Market Size by Type (2019-2024)
        5.3.2 World Chip Packaging Market Size by Type (2025-2030)
        5.3.3 World Chip Packaging Market Size Market Share by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Chip Packaging Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Automotive and Traffic
        6.2.2 Consumer Electronics
        6.2.3 Communication
        6.2.4 Other
        6.2.5 Other
    6.3 Market Segment by Application
        6.3.1 World Chip Packaging Market Size by Application (2019-2024)
        6.3.2 World Chip Packaging Market Size by Application (2025-2030)
        6.3.3 World Chip Packaging Market Size by Application (2019-2030)

7 Company Profiles
    7.1 ASE Group
        7.1.1 ASE Group Details
        7.1.2 ASE Group Major Business
        7.1.3 ASE Group Chip Packaging Product and Services
        7.1.4 ASE Group Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.1.5 ASE Group Recent Developments/Updates
        7.1.6 ASE Group Competitive Strengths & Weaknesses
    7.2 Amkor Technology
        7.2.1 Amkor Technology Details
        7.2.2 Amkor Technology Major Business
        7.2.3 Amkor Technology Chip Packaging Product and Services
        7.2.4 Amkor Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.2.5 Amkor Technology Recent Developments/Updates
        7.2.6 Amkor Technology Competitive Strengths & Weaknesses
    7.3 JCET
        7.3.1 JCET Details
        7.3.2 JCET Major Business
        7.3.3 JCET Chip Packaging Product and Services
        7.3.4 JCET Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.3.5 JCET Recent Developments/Updates
        7.3.6 JCET Competitive Strengths & Weaknesses
    7.4 Siliconware Precision Industries
        7.4.1 Siliconware Precision Industries Details
        7.4.2 Siliconware Precision Industries Major Business
        7.4.3 Siliconware Precision Industries Chip Packaging Product and Services
        7.4.4 Siliconware Precision Industries Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.4.5 Siliconware Precision Industries Recent Developments/Updates
        7.4.6 Siliconware Precision Industries Competitive Strengths & Weaknesses
    7.5 Powertech Technology
        7.5.1 Powertech Technology Details
        7.5.2 Powertech Technology Major Business
        7.5.3 Powertech Technology Chip Packaging Product and Services
        7.5.4 Powertech Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.5.5 Powertech Technology Recent Developments/Updates
        7.5.6 Powertech Technology Competitive Strengths & Weaknesses
    7.6 TongFu Microelectronics
        7.6.1 TongFu Microelectronics Details
        7.6.2 TongFu Microelectronics Major Business
        7.6.3 TongFu Microelectronics Chip Packaging Product and Services
        7.6.4 TongFu Microelectronics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.6.5 TongFu Microelectronics Recent Developments/Updates
        7.6.6 TongFu Microelectronics Competitive Strengths & Weaknesses
    7.7 Tianshui Huatian Technology
        7.7.1 Tianshui Huatian Technology Details
        7.7.2 Tianshui Huatian Technology Major Business
        7.7.3 Tianshui Huatian Technology Chip Packaging Product and Services
        7.7.4 Tianshui Huatian Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.7.5 Tianshui Huatian Technology Recent Developments/Updates
        7.7.6 Tianshui Huatian Technology Competitive Strengths & Weaknesses
    7.8 UTAC
        7.8.1 UTAC Details
        7.8.2 UTAC Major Business
        7.8.3 UTAC Chip Packaging Product and Services
        7.8.4 UTAC Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.8.5 UTAC Recent Developments/Updates
        7.8.6 UTAC Competitive Strengths & Weaknesses
    7.9 Chipbond Technology
        7.9.1 Chipbond Technology Details
        7.9.2 Chipbond Technology Major Business
        7.9.3 Chipbond Technology Chip Packaging Product and Services
        7.9.4 Chipbond Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.9.5 Chipbond Technology Recent Developments/Updates
        7.9.6 Chipbond Technology Competitive Strengths & Weaknesses
    7.10 Hana Micron
        7.10.1 Hana Micron Details
        7.10.2 Hana Micron Major Business
        7.10.3 Hana Micron Chip Packaging Product and Services
        7.10.4 Hana Micron Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.10.5 Hana Micron Recent Developments/Updates
        7.10.6 Hana Micron Competitive Strengths & Weaknesses
    7.11 OSE
        7.11.1 OSE Details
        7.11.2 OSE Major Business
        7.11.3 OSE Chip Packaging Product and Services
        7.11.4 OSE Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.11.5 OSE Recent Developments/Updates
        7.11.6 OSE Competitive Strengths & Weaknesses
    7.12 Walton Advanced Engineering
        7.12.1 Walton Advanced Engineering Details
        7.12.2 Walton Advanced Engineering Major Business
        7.12.3 Walton Advanced Engineering Chip Packaging Product and Services
        7.12.4 Walton Advanced Engineering Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.12.5 Walton Advanced Engineering Recent Developments/Updates
        7.12.6 Walton Advanced Engineering Competitive Strengths & Weaknesses
    7.13 NEPES
        7.13.1 NEPES Details
        7.13.2 NEPES Major Business
        7.13.3 NEPES Chip Packaging Product and Services
        7.13.4 NEPES Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.13.5 NEPES Recent Developments/Updates
        7.13.6 NEPES Competitive Strengths & Weaknesses
    7.14 Unisem
        7.14.1 Unisem Details
        7.14.2 Unisem Major Business
        7.14.3 Unisem Chip Packaging Product and Services
        7.14.4 Unisem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.14.5 Unisem Recent Developments/Updates
        7.14.6 Unisem Competitive Strengths & Weaknesses
    7.15 ChipMOS
        7.15.1 ChipMOS Details
        7.15.2 ChipMOS Major Business
        7.15.3 ChipMOS Chip Packaging Product and Services
        7.15.4 ChipMOS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.15.5 ChipMOS Recent Developments/Updates
        7.15.6 ChipMOS Competitive Strengths & Weaknesses
    7.16 Signetics
        7.16.1 Signetics Details
        7.16.2 Signetics Major Business
        7.16.3 Signetics Chip Packaging Product and Services
        7.16.4 Signetics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.16.5 Signetics Recent Developments/Updates
        7.16.6 Signetics Competitive Strengths & Weaknesses
    7.17 Carsem
        7.17.1 Carsem Details
        7.17.2 Carsem Major Business
        7.17.3 Carsem Chip Packaging Product and Services
        7.17.4 Carsem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.17.5 Carsem Recent Developments/Updates
        7.17.6 Carsem Competitive Strengths & Weaknesses
    7.18 King Yuan ELECTRONICS
        7.18.1 King Yuan ELECTRONICS Details
        7.18.2 King Yuan ELECTRONICS Major Business
        7.18.3 King Yuan ELECTRONICS Chip Packaging Product and Services
        7.18.4 King Yuan ELECTRONICS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024)
        7.18.5 King Yuan ELECTRONICS Recent Developments/Updates
        7.18.6 King Yuan ELECTRONICS Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Chip Packaging Industry Chain
    8.2 Chip Packaging Upstream Analysis
    8.3 Chip Packaging Midstream Analysis
    8.4 Chip Packaging Downstream Analysis

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World Chip Packaging Revenue by Region (2019, 2023 and 2030) & (USD Million), (by Headquarter Location)
    Table 2. World Chip Packaging Revenue by Region (2019-2024) & (USD Million), (by Headquarter Location)
    Table 3. World Chip Packaging Revenue by Region (2025-2030) & (USD Million), (by Headquarter Location)
    Table 4. World Chip Packaging Revenue Market Share by Region (2019-2024), (by Headquarter Location)
    Table 5. World Chip Packaging Revenue Market Share by Region (2025-2030), (by Headquarter Location)
    Table 6. Major Market Trends
    Table 7. World Chip Packaging Consumption Value Growth Rate Forecast by Region (2019 & 2023 & 2030) & (USD Million)
    Table 8. World Chip Packaging Consumption Value by Region (2019-2024) & (USD Million)
    Table 9. World Chip Packaging Consumption Value Forecast by Region (2025-2030) & (USD Million)
    Table 10. World Chip Packaging Revenue by Player (2019-2024) & (USD Million)
    Table 11. Revenue Market Share of Key Chip Packaging Players in 2023
    Table 12. World Chip Packaging Industry Rank of Major Player, Based on Revenue in 2023
    Table 13. Global Chip Packaging Company Evaluation Quadrant
    Table 14. Head Office of Key Chip Packaging Player
    Table 15. Chip Packaging Market: Company Product Type Footprint
    Table 16. Chip Packaging Market: Company Product Application Footprint
    Table 17. Chip Packaging Mergers & Acquisitions Activity
    Table 18. United States VS China Chip Packaging Market Size Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 19. United States VS China Chip Packaging Consumption Value Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 20. United States Based Chip Packaging Companies, Headquarters (States, Country)
    Table 21. United States Based Companies Chip Packaging Revenue, (2019-2024) & (USD Million)
    Table 22. United States Based Companies Chip Packaging Revenue Market Share (2019-2024)
    Table 23. China Based Chip Packaging Companies, Headquarters (Province, Country)
    Table 24. China Based Companies Chip Packaging Revenue, (2019-2024) & (USD Million)
    Table 25. China Based Companies Chip Packaging Revenue Market Share (2019-2024)
    Table 26. Rest of World Based Chip Packaging Companies, Headquarters (States, Country)
    Table 27. Rest of World Based Companies Chip Packaging Revenue, (2019-2024) & (USD Million)
    Table 28. Rest of World Based Companies Chip Packaging Revenue Market Share (2019-2024)
    Table 29. World Chip Packaging Market Size by Type, (USD Million), 2019 & 2023 & 2030
    Table 30. World Chip Packaging Market Size by Type (2019-2024) & (USD Million)
    Table 31. World Chip Packaging Market Size by Type (2025-2030) & (USD Million)
    Table 32. World Chip Packaging Market Size by Application, (USD Million), 2019 & 2023 & 2030
    Table 33. World Chip Packaging Market Size by Application (2019-2024) & (USD Million)
    Table 34. World Chip Packaging Market Size by Application (2025-2030) & (USD Million)
    Table 35. ASE Group Basic Information, Area Served and Competitors
    Table 36. ASE Group Major Business
    Table 37. ASE Group Chip Packaging Product and Services
    Table 38. ASE Group Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 39. ASE Group Recent Developments/Updates
    Table 40. ASE Group Competitive Strengths & Weaknesses
    Table 41. Amkor Technology Basic Information, Area Served and Competitors
    Table 42. Amkor Technology Major Business
    Table 43. Amkor Technology Chip Packaging Product and Services
    Table 44. Amkor Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 45. Amkor Technology Recent Developments/Updates
    Table 46. Amkor Technology Competitive Strengths & Weaknesses
    Table 47. JCET Basic Information, Area Served and Competitors
    Table 48. JCET Major Business
    Table 49. JCET Chip Packaging Product and Services
    Table 50. JCET Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 51. JCET Recent Developments/Updates
    Table 52. JCET Competitive Strengths & Weaknesses
    Table 53. Siliconware Precision Industries Basic Information, Area Served and Competitors
    Table 54. Siliconware Precision Industries Major Business
    Table 55. Siliconware Precision Industries Chip Packaging Product and Services
    Table 56. Siliconware Precision Industries Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 57. Siliconware Precision Industries Recent Developments/Updates
    Table 58. Siliconware Precision Industries Competitive Strengths & Weaknesses
    Table 59. Powertech Technology Basic Information, Area Served and Competitors
    Table 60. Powertech Technology Major Business
    Table 61. Powertech Technology Chip Packaging Product and Services
    Table 62. Powertech Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 63. Powertech Technology Recent Developments/Updates
    Table 64. Powertech Technology Competitive Strengths & Weaknesses
    Table 65. TongFu Microelectronics Basic Information, Area Served and Competitors
    Table 66. TongFu Microelectronics Major Business
    Table 67. TongFu Microelectronics Chip Packaging Product and Services
    Table 68. TongFu Microelectronics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 69. TongFu Microelectronics Recent Developments/Updates
    Table 70. TongFu Microelectronics Competitive Strengths & Weaknesses
    Table 71. Tianshui Huatian Technology Basic Information, Area Served and Competitors
    Table 72. Tianshui Huatian Technology Major Business
    Table 73. Tianshui Huatian Technology Chip Packaging Product and Services
    Table 74. Tianshui Huatian Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 75. Tianshui Huatian Technology Recent Developments/Updates
    Table 76. Tianshui Huatian Technology Competitive Strengths & Weaknesses
    Table 77. UTAC Basic Information, Area Served and Competitors
    Table 78. UTAC Major Business
    Table 79. UTAC Chip Packaging Product and Services
    Table 80. UTAC Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 81. UTAC Recent Developments/Updates
    Table 82. UTAC Competitive Strengths & Weaknesses
    Table 83. Chipbond Technology Basic Information, Area Served and Competitors
    Table 84. Chipbond Technology Major Business
    Table 85. Chipbond Technology Chip Packaging Product and Services
    Table 86. Chipbond Technology Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 87. Chipbond Technology Recent Developments/Updates
    Table 88. Chipbond Technology Competitive Strengths & Weaknesses
    Table 89. Hana Micron Basic Information, Area Served and Competitors
    Table 90. Hana Micron Major Business
    Table 91. Hana Micron Chip Packaging Product and Services
    Table 92. Hana Micron Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 93. Hana Micron Recent Developments/Updates
    Table 94. Hana Micron Competitive Strengths & Weaknesses
    Table 95. OSE Basic Information, Area Served and Competitors
    Table 96. OSE Major Business
    Table 97. OSE Chip Packaging Product and Services
    Table 98. OSE Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 99. OSE Recent Developments/Updates
    Table 100. OSE Competitive Strengths & Weaknesses
    Table 101. Walton Advanced Engineering Basic Information, Area Served and Competitors
    Table 102. Walton Advanced Engineering Major Business
    Table 103. Walton Advanced Engineering Chip Packaging Product and Services
    Table 104. Walton Advanced Engineering Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 105. Walton Advanced Engineering Recent Developments/Updates
    Table 106. Walton Advanced Engineering Competitive Strengths & Weaknesses
    Table 107. NEPES Basic Information, Area Served and Competitors
    Table 108. NEPES Major Business
    Table 109. NEPES Chip Packaging Product and Services
    Table 110. NEPES Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 111. NEPES Recent Developments/Updates
    Table 112. NEPES Competitive Strengths & Weaknesses
    Table 113. Unisem Basic Information, Area Served and Competitors
    Table 114. Unisem Major Business
    Table 115. Unisem Chip Packaging Product and Services
    Table 116. Unisem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 117. Unisem Recent Developments/Updates
    Table 118. Unisem Competitive Strengths & Weaknesses
    Table 119. ChipMOS Basic Information, Area Served and Competitors
    Table 120. ChipMOS Major Business
    Table 121. ChipMOS Chip Packaging Product and Services
    Table 122. ChipMOS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 123. ChipMOS Recent Developments/Updates
    Table 124. ChipMOS Competitive Strengths & Weaknesses
    Table 125. Signetics Basic Information, Area Served and Competitors
    Table 126. Signetics Major Business
    Table 127. Signetics Chip Packaging Product and Services
    Table 128. Signetics Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 129. Signetics Recent Developments/Updates
    Table 130. Signetics Competitive Strengths & Weaknesses
    Table 131. Carsem Basic Information, Area Served and Competitors
    Table 132. Carsem Major Business
    Table 133. Carsem Chip Packaging Product and Services
    Table 134. Carsem Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 135. Carsem Recent Developments/Updates
    Table 136. King Yuan ELECTRONICS Basic Information, Area Served and Competitors
    Table 137. King Yuan ELECTRONICS Major Business
    Table 138. King Yuan ELECTRONICS Chip Packaging Product and Services
    Table 139. King Yuan ELECTRONICS Chip Packaging Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 140. Global Key Players of Chip Packaging Upstream (Raw Materials)
    Table 141. Chip Packaging Typical Customers
List of Figure
    Figure 1. Chip Packaging Picture
    Figure 2. World Chip Packaging Total Market Size: 2019 & 2023 & 2030, (USD Million)
    Figure 3. World Chip Packaging Total Market Size (2019-2030) & (USD Million)
    Figure 4. World Chip Packaging Revenue Market Share by Region (2019, 2023 and 2030) & (USD Million) , (by Headquarter Location)
    Figure 5. World Chip Packaging Revenue Market Share by Region (2019-2030), (by Headquarter Location)
    Figure 6. United States Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 7. China Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 8. Europe Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 9. Japan Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 10. South Korea Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 11. ASEAN Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 12. India Based Company Chip Packaging Revenue (2019-2030) & (USD Million)
    Figure 13. Chip Packaging Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 16. World Chip Packaging Consumption Value Market Share by Region (2019-2030)
    Figure 17. United States Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 18. China Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 19. Europe Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 20. Japan Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 21. South Korea Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 22. ASEAN Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 23. India Chip Packaging Consumption Value (2019-2030) & (USD Million)
    Figure 24. Producer Shipments of Chip Packaging by Player Revenue ($MM) and Market Share (%): 2023
    Figure 25. Global Four-firm Concentration Ratios (CR4) for Chip Packaging Markets in 2023
    Figure 26. Global Four-firm Concentration Ratios (CR8) for Chip Packaging Markets in 2023
    Figure 27. United States VS China: Chip Packaging Revenue Market Share Comparison (2019 & 2023 & 2030)
    Figure 28. United States VS China: Chip Packaging Consumption Value Market Share Comparison (2019 & 2023 & 2030)
    Figure 29. World Chip Packaging Market Size by Type, (USD Million), 2019 & 2023 & 2030
    Figure 30. World Chip Packaging Market Size Market Share by Type in 2023
    Figure 31. Traditional Packaging
    Figure 32. Advanced Packaging
    Figure 33. World Chip Packaging Market Size Market Share by Type (2019-2030)
    Figure 34. World Chip Packaging Market Size by Application, (USD Million), 2019 & 2023 & 2030
    Figure 35. World Chip Packaging Market Size Market Share by Application in 2023
    Figure 36. Automotive and Traffic
    Figure 37. Consumer Electronics
    Figure 38. Communication
    Figure 39. Other
    Figure 40. Chip Packaging Industrial Chain
    Figure 41. Methodology
    Figure 42. Research Process and Data Source

Companies Mentioned

ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS